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Title: The effect of co-planarity variation on anisotropic conductive adhesive assemblies
Authors: Dou, Guangbin
Whalley, David C.
Liu, Changqing
Issue Date: 2006
Publisher: © IEEE
Citation: DOU, G., WHALLEY, D.C. and LIU, C., 2006. The effect of co-planarity variation on anisotropic conductive adhesive assemblies. IN: Proceedings of the 56th Electronic Components and Technology Conference, May 30 - June 2, San Diego, pp. 932-938.
Abstract: Anisotropic Conductive Adhesives (ACAs) consist of a polymer adhesive matrix containing fine conductive particles dispersed either randomly, or more rarely in an ordered way. The primary objective of this experimental research was to understand the effects of a non-uniform bond thickness due to non co-planarity of the component or substrate terminations in ACA assemblies. This has been achieved through measurements of the conductivity variations of ACA joints in a number of ACA assemblies, where the component bump plane and substrate plane were deliberately held in different degrees of relative rotation from parallel during adhesive cure. Measurements of the joint resistances versus rotational angle, for a constant bonding force, were made for 10 levels of rotation of the chips relative to the substrates. The results showed that the resistances of the joints in the assemblies exhibited three distinct types of behaviour: stable joint resistances; gradually increasing resistances and unstable resistances. In conclusion, it is shown that ACA joints are very sensitive to the uniformity of the bond thickness, as the larger the rotations were, the lower and less uniform the joint conductivities were, however, the joints were uniform if the rotation angles were controlled within certain limits.
Description: This is a conference paper [© IEEE]. It is also available at: http://ieeexplore.ieee.org/ Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Version: Published
DOI: 10.1109/ECTC.2006.1645766
URI: https://dspace.lboro.ac.uk/2134/4212
ISSN: 0569-5503
Appears in Collections:Conference Papers and Presentations (Mechanical, Electrical and Manufacturing Engineering)

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