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Title: Complex low volume electronics simulation tool to improve yield and reliability
Authors: Segura-Velandia, Diana M.
Conway, Paul P.
West, Andrew A.
Whalley, David C.
Wilson, Antony R.
Huertas-Quintero, Lina A.M.
Issue Date: 2007
Publisher: © IEEE
Citation: SEGURA-VELANDIA, D.M. ... et al, 2007. Complex low volume electronics simulation tool to improve yield and reliability. IN: Proceedings, 32nd IEEE Electronic Manufacturing Technology Symposium, IEMT '07. San Jose, CA, USA, 3-5 Oct. 2007, pp. 1 - 7
Abstract: Assembly of Printed Circuit Boards (PCB) in low volumes and a high-mix requires a level of manual intervention during product manufacture, which leads to poor first time yield and increased production costs. Failures at the component-level and failures that stem from non-component causes (i.e. system-level), such as defects in design and manufacturing, can account for this poor yield. These factors have not been incorporated in prediction models due to the fact that systemfailure causes are not driven by well-characterised deterministic processes. A simulation and analysis support tool being developed that is based on a suite of interacting modular components with well defined functionalities and interfaces is presented in this paper. The CLOVES (Complex Low Volume Electronics Simulation) tool enables the characterisation and dynamic simulation of complete design; manufacturing and business processes (throughout the entire product life cycle) in terms of their propensity to create defects that could cause product failure. Details of this system and how it is being developed to fulfill changing business needs is presented in this paper. Using historical data and knowledge of previous printed circuit assemblies (PCA) design specifications and manufacturing experiences, defect and yield results can be effectively stored and re-applied for future problem solving. For example, past PCA design specifications can be used at design stage to amend designs or define process options to optimise the product yield and service reliability.
Description: This is a conference paper [© IEEE]. It is also available from: http://ieeexplore.ieee.org/servlet/opac?punumber=4417035. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Version: Published
DOI: 10.1109/IEMT.2007.4417046
URI: https://dspace.lboro.ac.uk/2134/4216
ISBN: 9781424413355
ISSN: 1089-8190
Appears in Collections:Conference Papers and Presentations (Mechanical, Electrical and Manufacturing Engineering)

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