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|Title: ||Integration issues in the development of a modelling and simulation tool for low volume high-complexity electronics manufacture|
|Authors: ||West, Andrew A.|
Segura-Velandia, Diana M.
Conway, Paul P.
Whalley, David C.
|Issue Date: ||2008|
|Publisher: ||© IEEE|
|Citation: ||WEST, A.A. ... et al, 2008. Integration issues in the development of a modelling and simulation tool for low volume high-complexity electronics manufacture. IN: Proceedings, 2nd IEEE Electronics Systemintegration Technology Conference, Greenwich, 1-4 Sept. 2008, pp. 1097 - 1102|
|Abstract: ||In order to design and implement the information
systems and modules that could comprise an “industrial
strong” knowledge-based tool, links to shop floor systems
containing real-time production data and PCA customer
information (e.g. bill of materials (BOM), CAD
drawings) are required. Details of the issues of
implementing the tool in an industrial organisation and
the integration of various data sources (e.g. “in-house”
developed systems, enterprise resource planning systems,
ad-hoc developed databases, machine data and CAD data)
are presented in this paper. The application of the
CLOVES system in an industrial setup highlights the
difficulties in integrating information from design as
CAD data and shows how these setbacks could be
overcome if the electronics industry were to adopt a
common CAD assembly information exchange platform.
Hence, this paper concludes that existing automation tool
manufacturers should focus exclusively on developing
generic connections by adopting industry standards that
can facilitate the deployment of “plug and play” tools.
This standardisation could in turn help software
developers, to provide the electronics industry with more
integrated systems that communicate better among
loosely coupled information systems and avoid depending
on extensive time consuming manual data input.|
|Description: ||This is a conference paper [© IEEE]. It is also available from: http://ieeexplore.ieee.org/servlet/opac?punumber=4658784. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.|
|Appears in Collections:||Conference Papers and Presentations (Mechanical, Electrical and Manufacturing Engineering)|
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