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|Title: ||Creep damage study at powercycling of lead-free surface mount device|
|Authors: ||Hegde, Pradeep|
Whalley, David C.
Silberschmidt, Vadim V.
|Issue Date: ||2009|
|Publisher: ||© Elsevier|
|Citation: ||HEGDE, P., WHALLEY, D.C. and SILBERSCHMIDT, V.V., 2009. Creep damage study at powercycling of lead-free surface mount. Computational Materials Science, 45 (3), pp. 638-645|
|Abstract: ||Soldering is extensively used to assemble electronic components to printed circuit boards or
chips to a substrate in microelectronic devices. These solder joints serve as mechanical,
thermal and electrical interconnections, therefore, their integrity is a key reliability concern.
However, newly introduced lead-free solders do not have a long history of applications in the
industry and there is a lack of established material models of their behaviour over the wide
temperature range experienced by electronics systems. Therefore, an extensive reliability
study is required before introducing a new lead-free solder material in the electronic
industries. Moreover, most of the solder materials have low melting temperatures, and are
prone to creep in service. The cyclic temperature operating condition (powercycling) of the
solder joint can result in the creep fatigue failure. Thus, a computational technique is used to
investigate creep damage in solder joints. The present paper deals with creep damage of leadfree
solder joints for powercycling using finite element analysis with the consideration of
experimentally observed non-uniform temperature distributions in the 1206 surface mount
chip resistor. In addition, a comparison is made for inelastic strain accumulation and fatigue
life for creep damage study for spatially uniform and non-uniform temperature powercycling.|
|Description: ||This article was published in the journal, Computational Materials Science [© Elsevier]. The definitive version is available at: www.elsevier.com/locate/commatsci|
|Version: ||Accepted for publication|
|Appears in Collections:||Published Articles (Mechanical and Manufacturing Engineering)|
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