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Title: Reliability assessment of a digital electronic board assembly using the physics-of-failure approach: a case study
Authors: Oguibe, Chucks N.
Williams, David J.
Keywords: Physics-of-failure method
Reliability enhancement
Fatigue life cycle
Electronic assemblies
Solder joint
Issue Date: 1999
Publisher: Professional Engineering Publishing / © IMechE
Citation: OGUIBE, C.N. and WILLIAMS, D.J., 1999. Reliability assessment of a digital electronic board assembly using the physics-of-failure approach: a case study. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 213 (8), pp. 833-839
Abstract: An independent study has been carried out to assess the extent to which the physics-of-failure (PoF) technique can help in reliability enhancement and assessment of electronic assemblies. In particular, a specific case study has been conducted on a real, digital electronic board assembly with known failure modes. Results from the study include the simulation of substrate and component temperatures based on the knowledge of component power dissipation, board assembly materials and cooling methods of the board assembly. The fundamental frequencies and dynamic displacements of the board were computed from the vibration models. The thermal and vibration results were then used to model the damage accumulation at solder joints of the components to accurately predict failure trends and failure sites. These results are compared with field failure data and results from other computer aided engineering (CAE) tools.
Description: This is an article from the journal, Proceedings of the IMechE, Part B: Journal of Engineering Manufacture [© IMechE]. It is also available at: http://journals.pepublishing.com/content/119784/?p=483cf2f3659441cdbcd851d8f3b10493&pi=0
Version: Published
DOI: 10.1243/0954405991517254
URI: https://dspace.lboro.ac.uk/2134/4752
ISSN: 0954-4054
Appears in Collections:Published Articles (Mechanical and Manufacturing Engineering)

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