+44 (0)1509 263171
Please use this identifier to cite or link to this item:
|Title: ||Propagation modes of surface discharge plasma in a metallized polymer film capacitor|
|Authors: ||Lee, Y.P.|
Kong, Michael G.
|Issue Date: ||2001|
|Publisher: ||© IEEE|
|Citation: ||LEE, Y.P. and KONG, M.G., 2001. Propagation modes of surface discharge plasma in a metallized polymer film capacitor. IN: 2001 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, 14-17 Oct., Kitchener, Ont., Canada, pp. 192-196.|
|Abstract: ||Surface breakdowns and their associated discharges are an important failure mechanism of metallized polymer film capacitors. To assess propagation of such discharges on the electrode coating surface and hence the impact on capacitor performance, we have recently developed a surface plasma model under non-equilibrium conditions. Through the identification of an electrical field mechanism and a temperature gradient mechanism, we have established a parametric range within which these surface plasmas are unlikely to elongate. Theoretical models of surface discharges are useful for a quantitative understanding of failure mechanisms in film capacitors. In this contribution, we extend our work farther to study the dynamics of plasma propagation. Two propagation modes are identified, namely the elongation and extinction modes, and they are numerically explored over a very wide parametric range. Detailed features of plasma propagation provide important insights into their impact on capacitor performance. These results are also useful to aid optimization of capacitor designs through capacitor electrode architecture and insulation clearance|
|Description: ||This is a conference paper [© IEEE]. It is also available at: http://ieeexplore.ieee.org/ Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.|
|Appears in Collections:||Conference Papers and Contributions (Electronic, Electrical and Systems Engineering)|
Files associated with this item:
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.