Mechanical behaviour of grains in SnAgCu solder joints

Gong, Jicheng; Liu, Changqing; Conway, Paul; Silberschmidt, Vadim

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Mechanical behaviour of grains in SnAgCu solder joints

conference contribution

posted on 2009-09-23, 15:36 authored by Jicheng Gong, Changqing Liu, Paul ConwayPaul Conway, Vadim SilberschmidtVadim Silberschmidt

A collection of slides from the authors conference presentation is given.

History

School

Mechanical, Electrical and Manufacturing Engineering

Citation

GONG, J....et al., 2006. Mechanical behaviour of grains in SnAgCu solder joints. IN: International Conference on Electronic Materials and Packaging, (EMAP 2006), Kowloon, 11-14 Dec., pp. 1-21

Publisher

Version

VoR (Version of Record)

Publication date

2006

Notes

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