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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/5338

Title: Mechanical behaviour of grains in SnAgCu solder joints
Authors: Gong, Jicheng
Liu, Changqing
Conway, Paul P.
Silberschmidt, Vadim V.
Issue Date: 2006
Publisher: © IEEE
Citation: GONG, J....et al., 2006. Mechanical behaviour of grains in SnAgCu solder joints. IN: International Conference on Electronic Materials and Packaging, (EMAP 2006), Kowloon, 11-14 Dec., pp. 1-21
Abstract: A collection of slides from the authors conference presentation is given.
Description: This is a conference paper [© IEEE]. It is also available at: http://ieeexplore.ieee.org/ Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Version: Published
DOI: 10.1109/EMAP.2006.4430595
URI: https://dspace.lboro.ac.uk/2134/5338
ISBN: 9781424408344
Appears in Collections:Conference Papers and Presentations (Mechanical, Electrical and Manufacturing Engineering)

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