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Title: Crystallographic structure and mechanical behaviour of SnAgCu solder interconnects under a constant loading rate
Authors: Gong, Jicheng
Liu, Changqing
Conway, Paul P.
Silberschmidt, Vadim V.
Issue Date: 2007
Publisher: © IEEE
Citation: GONG, J., 2007. Crystallographic structure and mechanical behaviour of SnAgCu solder interconnects under a constant loading rate. IN: Proceedings of the 57th Electronic Components and Technology Conference, (ECTC '07), Reno, NV, May 29-June 1, pp. 677 - 683.
Abstract: With the continuing increase of the integration density in electronics, dimensions of interconnections for electronic components have been miniaturized to a scale that is comparable to those of their crystallographic structure. For instance, a SnAgCu solder joint in the flip chip package can contain only one or a few grains. In this case, the mechanical behaviour of the micro-joint is expected to shift from a polycrystalline-based to single-crystal one. Considering the further miniaturization, both the crystallographic structure and mechanics of each component (Ag3Sn, Cu6Sn5 and beta-Sn matrix) within a grain and the adjacent SnCu interface will play an important role in the reliability of the micro-joint due to their size comparable with that of a grain, irregular geometry, their heterogeneous distribution and considerably different properties. In addition, at such a small scale, the non-local effect on deformation of beta-Sn should be taken into account to interpret mechanical interactions between components. In this paper, a shearing test, in which it is possible to apply a constant loading to a SnAgCu joint is deigned to investigate mechanics of substructure within a SnAgCu grain and near the SnCu interface.
Description: This is a conference paper [© IEEE]. It is also available at: http://ieeexplore.ieee.org/ Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Version: Published
DOI: 10.1109/ECTC.2007.373869
URI: https://dspace.lboro.ac.uk/2134/5339
ISBN: 1424409853
ISSN: 0569-5503
Appears in Collections:Conference Papers and Presentations (Mechanical, Electrical and Manufacturing Engineering)

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