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|Title: ||Productionisation issues for commercialisation of microfluidic based devices|
|Authors: ||Webb, D.P.|
Knauf, Benedikt J.
Hutt, David A.
Conway, Paul P.
|Issue Date: ||2009|
|Publisher: ||© Emerald|
|Citation: ||WEBB, D.P....et al., 2009. Productionisation issues for commercialisation of microfluidic based devices. Sensor Review, 29(4), pp. 349-54.|
Microfluidic or “lab-on-a-chip” technology is seen as a key enabler in the rapidly
expanding market for medical point-of-care (POC) and other kinds of portable
diagnostic device. In this paper we discuss two proposed packaging processes for
large scale manufacture of microfluidic systems.
In the first packaging process, polymer overmoulding of a microfluidic chip is used to
form a fluidic manifold integrated with the device in a single step. The anticipated
advantages of the proposed method of packaging are ease of assembly and low part
count. The second process involves the use of low frequency induction heating
(LFIH) for the sealing of polymer microfluidics. The method requires no chamber,
and provides fast and selective heating to the interface to be joined.
Initial work with glass microfluidics has demonstrated feasibility for overmoulding
through two separate sealing principles. One is using the overmould as a physical
support structure and providing sealing using a compliant ferrule. The other relies on
adhesion between the material of the overmould and the microfluidic device to
provide a seal. As regards LFIH work on selection and structuring of susceptor
materials is reported, together with analysis of the dimensions of the heat affected
zone. Acrylic plates have been joined using a thin (<10 μm) nickel susceptor
providing a fluid seal that withstood a pressure of 590kPa.
Microfluidic chips have until now been produced in relatively small numbers. To
scale-up from laboratory systems to the production volumes required for mass
markets, packaging methods need to be adapted to mass manufacture.|
|Description: ||This is an article from the journal, Sensor Review [© Emerald]. It is also available at:www.emeraldinsight.com/10.1108/02602280910986601|
|Version: ||Accepted for publication|
|Appears in Collections:||Published Articles (Mechanical, Electrical and Manufacturing Engineering)|
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