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Title: The thermal stability of alkanethiol self-assembled monolayers on copper for fluxless soldering applications
Authors: Ebbens, Stephen
Hutt, David A.
Liu, Changqing
Keywords: Copper
Fluxless-soldering
Oxidation
Printed circuit boards
Self-assembled monolayers
Issue Date: 2010
Publisher: © IEEE
Citation: EBBENS, S., HUTT, D.A. and LIU, C., 2010. The thermal stability of alkanethiol self-assembled monolayers on copper for fluxless soldering applications. IEEE Transactions on Components and Packaging Technologies, 33(2), pp. 251-259.
Abstract: The ability of alkanethiol monolayers deposited on copper to prevent surface oxidation has suggested their application as preservatives for fluxless soldering. However, the utility of such coatings for this purpose will critically depend on their ability to continue to preserve the substrate during exposure to elevated temperatures throughout the electronics manufacturing process. Consequently, the aim of this paper is to systematically determine the effect of storage temperature and duration on the ability of alkanethiol coated copper samples to undergo fluxless soldering. Similarly, the effect of pre-heating copper immediately prior to soldering is also investigated. The effect of reducing atmospheric oxygen concentration during storage and soldering is also considered as a potential route to improve the thermal resilience of the coatings. Parallel to ascertaining these industrially relevant performance parameters, a quantitative correlation between surface chemistry and solder wetting is established, and the temperature dependence of the kinetics of surface oxidation through an alkanethiol barrier layer is discussed.
Description: This is a journal article [© IEEE]. It is also available at: http://ieeexplore.ieee.org/ Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Version: Published
DOI: 10.1109/TCAPT.2010.2041779
URI: https://dspace.lboro.ac.uk/2134/7129
Publisher Link: http://dx.doi.org/10.1109/TCAPT.2010.2041779
ISSN: 1521-3331
Appears in Collections:Published Articles (Mechanical and Manufacturing Engineering)

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