Optoelectronics manufacturers are under continuous pressure for
miniaturisation of optoelectronic modules. One route to further miniaturisation
is to reduce the spacing between the optical and optoelectronic components
in the optical path adhesively mounted to ceramic carriers. Flow control of the
adhesives over the ceramic surface is then imperative. Uncontrolled wetting
can lead to an excessive adhesive footprint which interferes in the application
of other adhesives for subsequent components. However, insufficient wetting
can lead to low strength bonds vulnerable to thermal fatigue and shear failure.
The goal of the work was to minimise the potential for uncontrolled wetting
while maintaining unmodified bond properties. In addition positional stability of
adhered parts on cure and in-service must not be detrimentally affected. [Continues.]
A Doctoral Thesis. Submitted in partial fulfillment of the requirements for the award of Doctor of Philosophy of Loughborough University.