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|Title: ||The effect of interface topography for Ultrasonic Consolidation of aluminium|
|Authors: ||Friel, Ross J.|
Johnson, Kenneth E.
Dickens, Phill M.
Harris, Russell A.
|Keywords: ||Ultrasonic Consolidation|
|Issue Date: ||2010|
|Publisher: ||© Elsevier|
|Citation: ||FRIEL, R.J. ... et al, 2010. The effect of interface topography for Ultrasonic Consolidation of aluminium. Materials Science & Engineering A, 527 (16-17), pp.4474-4483.|
|Abstract: ||Ultrasonic Consolidation (UC) is an additive manufacturing technology which is based on the
sequential solid-state ultrasonic welding of metal foils. UC presents a rapid and adaptive alternative
process, to other metal-matrix embedding technologies, for 'smart' metal composite material
production. A challenge that exists however relates to optimising, for bond density and plastic flow, the
interlaminar textures themselves that serve as the contact surfaces between the foils.
UC employs a sonotrode connected to a transducer to exude ultrasonic energy into the metal foil being
sequentially deposited. This sonotrode to metal contact imparts a noteworthy topology to the
processed metals surface that in turn becomes the crucial substrate topology of the subsequent layers
deposition. This work investigated UC processed Al 3003 samples to ascertain the effect of this
imparted topology on subsequent layer deposition. Surface and interlaminar topology profiles were
characterised using interferometry, electron and light microscopy. The physical effect of the topology
profiles were quantified via the use of peel testing.
The imparted topology profile was found to be of fundamental significance to the mechanical
performance and bond density achieved within the bulk laminate during UC. The UC process
parameters and sonotrode topology performed a key role in modifying this topology profile. The
concept of using a specifically textured sonotrode to attain desired future smart material performance
via UC is proposed by the authors.|
|Description: ||This article was published in the journal, Materials Science & Engineering A [© Elsevier]. The definitive version is available from: www.elsevier.com/locate/msea|
|Version: ||Accepted for publication|
|Publisher Link: ||http://dx.doi.org/10.1016/j.msea.2010.03.094|
|Appears in Collections:||Published Articles (Mechanical, Electrical and Manufacturing Engineering)|
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