Loughborough University
Leicestershire, UK
LE11 3TU
+44 (0)1509 263171
Loughborough University

Loughborough University Institutional Repository

Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/7705

Title: Low frequency induction heating for the sealing of plastic microfluidic systems
Authors: Knauf, Benedikt J.
Webb, D. Patrick
Liu, Changqing
Conway, Paul P.
Keywords: Microfluidic systems
Induction heating
Plastic bonding
Issue Date: 2010
Publisher: © Springer-Verlag
Citation: KNAUF, B.J. ... et al, 2010. Low frequency induction heating for the sealing of plastic microfluidic systems. Microfluidics and Nanofluidics, 9, (2-3), pp. 243-252.
Abstract: Microfluidic systems are being used in many applications and the demand for such systems has been phenomenal in past decades. To meet such high volume market needs, a cheap and rapid method for sealing these microfluidic platforms which is viable for mass manufacture is highly desirable. Low frequency induction heating has been introduced as potential basis of a cost-effective, rapid production method for polymer microfluidic device sealing in preceding publications. Through this technique excellent bond strength was achieved, withstanding an air-pressure of up to 590 kPa. However, it has been found that during the bonding process it is important to effectively manage the heat dissipation to prevent distortion of the microfluidic platform. The heat affected zone, and the localised melted area, must be controlled to avoid blockage of the microfluidic channels or altering the channels’ wall characteristics. This work presents an analytical approach to address the issues and provide a basis for process optimisation and design rules.
Description: The original version is available at: http://www.springerlink.com/
Version: Accepted for publication
DOI: 10.1007/s10404-009-0539-x
URI: https://dspace.lboro.ac.uk/2134/7705
Publisher Link: http://dx.doi.org/10.1007/s10404-009-0539-x
ISSN: 1613-4982
Appears in Collections:Published Articles (Mechanical, Electrical and Manufacturing Engineering)

Files associated with this item:

File Description SizeFormat
Knauf accepted version.pdf373.57 kBAdobe PDFView/Open


SFX Query

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.