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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/7942

Title: Epoxy adhesive behaviour on ceramic surfaces in commercial optoelectronic assemblies
Authors: Williams, Owain
Liu, C.
Webb, D.P.
Firth, P.
Keywords: Epoxy/epoxides
Ceramics
Epoxy bleed
Issue Date: 2010
Publisher: © Elsevier
Citation: WILLIAMS, O. ... et al, 2010. Epoxy adhesive behaviour on ceramic surfaces in commercial optoelectronic assemblies. International Journal of Adhesion and Adhesives, 30 (4), pp. 225-235.
Abstract: Chemical and physical variability in the as-received state of aluminium oxide and aluminium nitride ceramic substrate materials used in optoelectronic modules currently leads to a process yield less than 100% when adhesives are used for assembly and interconnection. The phenomenon of epoxy bleed is a contributing factor to this yield and steps are not yet taken in the industry to control or inhibit the undesirable wetting. Standard surface texture measurement techniques, XPS and contact angle measurements were implemented to characterise and compare commercial as-received samples. The quality controls currently in place are assessed and additional analysis methods in the QC stage are suggested for increasing yield. Commercially available conductive and thermally conductive adhesives, also used in optoelectronic module manufacture, were studied along with the surfaces.
Version: Accepted for publication
DOI: 10.1016/j.ijadhadh.2010.02.001
URI: https://dspace.lboro.ac.uk/2134/7942
Publisher Link: http://dx.doi.org/10.1016/j.ijadhadh.2010.02.001
ISSN: 0143-7496
Appears in Collections:Published Articles (Mechanical and Manufacturing Engineering)

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