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Title: Conductivity of acid zinc and copper plating solutions
Authors: Gabe, D.R.
Li, M.
Ding, Z.
Issue Date: 2011
Publisher: Maney Publishing / © Institute of Metal Finishing
Citation: GABE, D.R., LI, M. and DING, Z., 2011. Conductivity of acid zinc and copper plating solutions. Transactions of the Institute of Metal Finishing, 89 (2), pp. 74-77.
Abstract: Conductivity data are presented for the common acid solutions (sulphate, chloride) used in the electrodeposition of zinc and copper. Optimised solution concentrations may be defi ned and the values obtained indicate the dominant ions which are present in solution at specifi c concentrations and temperatures.
Version: Accepted for publication
DOI: 10.1179/174591911X12973566250268
URI: https://dspace.lboro.ac.uk/2134/8379
Publisher Link: http://dx.doi.org/10.1179/174591911X12973566250268
ISSN: 0020-2967
1745-9192
Appears in Collections:Published Articles (Materials)

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