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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/8822

Title: Analysis of critical-length data from electromigration failure studies
Authors: Dwyer, Vincent M.
Issue Date: 2011
Publisher: © Elsevier Ltd.
Citation: DWYER, V.M., 2011. Analysis of critical-length data from electromigration failure studies. Microelectronics Reliability. Proceedings of the 22th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis, 51 (9-11), pp. 1568-1572.
Abstract: An accurate estimation of the Blech length, the critical line length below which interconnect lines are immortal, is vital as it allows EDA tools to reduce their workload. In lines longer than the Blech length, either a void will inevitably nucleate and grow until the line fails, or the line will rupture. The majority of failure analyses reveal voiding as the failure mechanism however recent analysis suggest Blech length failures are characterised by simultaneous [6] voiding and rupture, and a non-zero steady-state drift velocity. This paper provides an alternative interpretation of results.
Description: This article was published in the journal, Microelectronics Reliability, Proceedings of the 22th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis [© Elsevier Ltd.] and the definitive version is available at: http://dx.doi.org/10.1016/j.microrel.2011.06.036
Version: Accepted for publication
DOI: 10.1016/j.microrel.2011.06.036
URI: https://dspace.lboro.ac.uk/2134/8822
Publisher Link: http://dx.doi.org/10.1016/j.microrel.2011.06.036
Appears in Collections:Published Articles (Electronic, Electrical and Systems Engineering)

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