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Polymer optical waveguide fabrication using laser ablation

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conference contribution
posted on 2011-11-09, 15:15 authored by Shefiu S. Zakariyah, Paul ConwayPaul Conway, David HuttDavid Hutt, David Selviah, Kai Wang, Hadi Baghsiahi, Jeremy Rygate, Jonathan Calver, Witold Kandulski
Due to their inherent bandwidth capacity, optical interconnects are replacing copper as bottlenecks begin to appear within the various interconnect levels of electronics systems. Current optical interconnect solutions found in industry are based upon optical fibres and are capable of providing a suitable platform for inter-board applications. However, to allow high speed interconnects between components and within systems, optically enabled printed circuit boards containing waveguides are essential. One way in which this can be accomplished is through the integration of polymer optical waveguides into traditional printed circuit boards (PCBs). There are a number of routes to accomplish this including photolithography and laser direct imaging, however, this paper explores laser ablation using UV and IR sources namely: 248 nm Excimer, 355 nm UV Nd:YAG and 10.6 μm CO2, to form waveguide structures in optical polymer materials. The paper presents the process route and initial results of trials conducted to fabricate waveguides and indicate the variation in the structures formed by the different lasers. The demonstration of the use of these three lasers for optical waveguide fabrication may provide a route to the rapid deployment of this technology into the PCB industry through the use of existing infrastructure.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Citation

ZAKARIYAH, S.S....et al., 2009. Polymer optical waveguide fabrication using laser ablation. IN: 11th Electronics Packaging Technology Conference, (EPTC '09). Shangri-La Hotel, Singapore, 9 - 11 December, 7pp.

Publisher

© IEEE

Version

  • AM (Accepted Manuscript)

Publication date

2009

Notes

© 2009 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

ISBN

9781424451005;9781424450992

Language

  • en

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