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|Title: ||Polymer optical waveguide fabrication using laser ablation|
|Authors: ||Zakariyah, Shefiu S.|
Conway, Paul P.
Hutt, David A.
|Issue Date: ||2009|
|Publisher: ||© IEEE|
|Citation: ||ZAKARIYAH, S.S....et al., 2009. Polymer optical waveguide fabrication using laser ablation. IN: 11th Electronics Packaging Technology Conference, (EPTC '09). Shangri-La Hotel, Singapore, 9 - 11 December, 7pp.|
|Abstract: ||Due to their inherent bandwidth capacity, optical
interconnects are replacing copper as bottlenecks begin to
appear within the various interconnect levels of electronics
systems. Current optical interconnect solutions found in
industry are based upon optical fibres and are capable of
providing a suitable platform for inter-board applications.
However, to allow high speed interconnects between
components and within systems, optically enabled printed
circuit boards containing waveguides are essential. One way
in which this can be accomplished is through the integration of
polymer optical waveguides into traditional printed circuit
boards (PCBs). There are a number of routes to accomplish
this including photolithography and laser direct imaging,
however, this paper explores laser ablation using UV and IR
sources namely: 248 nm Excimer, 355 nm UV Nd:YAG and
10.6 μm CO2, to form waveguide structures in optical polymer
materials. The paper presents the process route and initial
results of trials conducted to fabricate waveguides and indicate
the variation in the structures formed by the different lasers.
The demonstration of the use of these three lasers for optical
waveguide fabrication may provide a route to the rapid
deployment of this technology into the PCB industry through
the use of existing infrastructure.|
|Description: ||© 2009 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.|
|Version: ||Accepted for publication|
|Publisher Link: ||http://dx.doi.org/10.1109/EPTC.2009.5416408|
|Appears in Collections:||Conference Papers and Presentations (Mechanical, Electrical and Manufacturing Engineering)|
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